The International Microelectronics Assembly and Packaging Society (IMAPS) awards the William D. Ashman Achievement Award once every year to an individual who has made significant technical contributions to the electronics packaging industry.
The 2016 William D. Ashman Achievement Award was awarded to Prof. Dr. Dr. Klaus Dieter-Lang for his exceptional contribution to the development of electronic packaging for advanced system-integration. This prestigious award was handed over to Prof. Lang by IMAPS President, Susan Trulli, on October 10, 2017 during the award presentation ceremony at the 50th International Symposium on Microelectronics in Raleigh, NC, USA.
IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies worldwide. Prof. Lang has been the director of Fraunhofer IZM since 2011. He is a Fellow, and Life Member of IMAPS, as well as a Senior Member of IEEE.