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Event 

EMPC-2011
Title:
EMPC-2011
When:
12.09.2011 - 15.09.2011
Where:
Hilton Metropole - Brighton
Category:
IMAPS-Europe

Description

 

  European Microelectronics and Packaging Conference (EMPC-2011)

  Brighton, UK,

  12th -15th September 2011

 

 

  The Event

IMAPS-Europe European Microelectronics and Packaging Conference EMPC is the Major Electronics packaging, interconnection and integration conference of Europe. EMPC2011 is technically co-sponsored by IMAPS-Europe and IEEE-CPMT and builds upon the successful IEEE Electronics System-Integration Technology Conference ESTC (2010, Berlin) and EMPC2009, (2009) Rimini. Each biennial event attracted over 350 delegates worldwide. EMPC-2011 is proudly hosted by IMAPS-UK chapter and will be held at the Hilton Metropole, Brighton, UK, 12th to 15th September 2011.

 

 The Location Brighton is one of England’s loveliest and liveliest cities by the sea. It is also a great location to reach London,  and many of the sights of Southern England. It’s a fun, thriving, cosmopolitan city with just a touch of eccentricity. Brighton is a fantastic mixture of classical architecture, 21st century nightlife, endless shopping, top quality performing arts and the best selection of restaurants outside central London – all within easy walking distance. The Hilton is ideally located directly on the seafront with uninterrupted sea views and immediate access to the beach. Further along the shore is Brighton Marina and the world famous Brighton Pier. Other notable sites are nearby.

 

Announcement EMPC-2011 will take to Brighton the best of microelectronics packaging and interconnection technologies, thus offering top quality coverage of technological innovation in this field. The four conference days from 12th to 15th September 2011 will consist of Short Courses/Tutorials, the Conference and an Exhibition. The event will be complemented by Poster Sessions and Social Events.Researchers and innovators in industry and academia are cordially invited to submit papers on Microelectronics Technologies for oral or poster presentation at the Conference. Please contact This e-mail address is being protected from spambots. You need JavaScript enabled to view it with any queries.

 

The Conference Topics include

ADVANCED PACKAGING: Single Chip and Multi Chip Packaging, Wafer Level Packaging, 3D-WLP, 3D-IC, SIP, SOP and other Systems-Integration Technologies,  Embedded Passives on Wafers and Substrates, High Frequency and High Power Packaging, LTCC Technologies, PCB and BGA Substrates Design and Technologies, Laminates, Micro-Vias and Build-Up Technologies, Flex, MID.

BUSINESS ASPECTS: All business aspects of the microelectronics packaging and assembly industry and the supply chain

INTERCONNECTION TECHNOLOGIES: Thick and Thin Film Technologies, Wire Bonding, Bumping, Flip Chip Bonding, Cu/Low-k Wafers, Through Silicon Vias, Lead-Free Soldering and Adhesive Joining.

MANUFACTURING TECHNOLOGIES AND MATERIALS: Process Development, New Equipment, Yield Improvement, Cost and Cycle Time Reduction, Green Manufacturing, Adhesives, Encapsulants, Underfills, Moulding Compounds, Lead-Free Solder Alloys, Halogen Free Materials, Dielectrics and Ceramics.

MEDICAL ELECTRONICS: Applications, Design, Development, Manufacturing that comply with complex and demanding regulations and market requirements.

MEMS PACKAGING: MEMS Based Sensors and Actuators Packaging, RF-MEMS, Optical MEMS and Bio-MEMS

MODELLING: Electrical Modelling,  Signal Integrity: TDMA and FDMAof Interconnection & Packaging, Thermal Characterisation,  Cooling Solutions - Methodology for Characterisation of Advanced Packaging, Modules & Systems, Novel Cooling , Mechanical Modelling,  Structural Integrity, Thermo-Mechanical Stress Analysis, Vibration & Shock Tests;

MORE THAN MOORE: The future of IC shrinkage,  future options for IC packaging & interconnect, 3D

NANO TECHNOLOGIES: Smart Materials, Interconnections, Nano-Scale Packaging,

OPTOELECTRONICS: Power LED Assembly, Packaging and Light Guiding, Packaging of Optoelectronic Modules suitable for Gb/s Fibre Optic Communication,

POWER ELECTRONICS: Application in Consumer, Telecom, Automotive, Wearable, Space and Defence.

RELIABILITY and QUALITY: Specialised topics, Component, Board and System Level Reliability Assessment, Failure Analysis, Interfacial Adhesion, and Accelerated Testing

SMART TEXTILES: Materials, Technologies, Applications, Markets, Roadmaps

SOLAR ENERGY & PHOTOVOLTAICS: Packaging & Interconnection, Design to improve Efficiency of Photovoltaic modules, Reliability and Qualification Approaches

SHORT COURSES / TUTORIALS: An Excellent set of short Courses is now in place. To see the Short Course list and register to attend, please click on www.empc2011.com

OPPORTUNITY TO EXHIBIT: The exhibition is an important element of the EMPC format and compliments the Technical conference. The exhibition is based on space only or a shell scheme within the Exhibition Hall. The exhibition is positioned near the technical session rooms. Refreshments will be located in the Exhibition Hall together with meeting tables to encourage delegate flow into the exhibition. Details of Exhibition Hall layout, pricing and how to book and are provided in the Exhibitor Registration Pack, which can be downloaded at www.empc2011.com For exhibition bookings and information: Contact Louisa at This e-mail address is being protected from spambots. You need JavaScript enabled to view it

 

Venue

Venue:
Hilton Metropole   -   Website
City:
Brighton
Country:
Country: gb

Description

Sorry, no description available

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