The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education and training, interaction with industry and networking amongst professionals and academics.
Founded in 1967, IMAPS is the leading international microelectronics and electronics packaging society with professional members in 23 North American chapters and 21 international chapters. Microelectronics Foundation provides annual grants to students involved in electronics packaging disciplines.
IMAPS-Europe comprises eleven IMAPS Chapters. The members of the chapters embrace the community of microelectronics packaging engineers throughout Europe. www.imapseurope.org contains news, events, committee information, member directories. The IMAPS European chapters are the independent local Chapters of IMAPS throughout Europe. Their members number over 1000 individuals plus additional corporate members in some chapters. Membership is always local to a chapter. The Chapters are listed on next page. The IMAPS European chapters organize national and international seminars, workshops and conferences.
The flagship event being the EMPC, which is held every odd year interleaved with ESTC every even year with mutual access to both events
Turino, June 15-16, 2017
together with the Electric and Electronic Italian Association (AEIT), IMAPS Italy is organising the 2nd edition of the Conference on Electrical and Electronic technologies for Automotive – AUTOMOTIVE 2017.
AUTOMOTIVE 2017 will be structured in two days with Scientific Sessions, including both presented papers and a poster session, keynote speeches, round tables and panel discussion, covering current automotive scenarios with their national and international perspectives, development trends and the regulatory framework.
A Technical Exhibition with Industry attendance will be held.
AUTOMOTIVE 2017 is aimed at an academic and industrial audience, professionals active in automotive, including designers, manufacturers and users of technology, as well as analysts and investors interested in this sector in great development and of high social impact.
A specific IMAPS session will be held on the afternoon of June 15.
Location: Politecnico di Torino, Turino Italy
in technical co-sponsorship with IEEE CPMT
18th – 20th June 2017, Läppstiftet Conference Center, Gothenburg, Sweden
The IMAPS Nordic Conference on Microelectronics Packaging (NordPac) will be held 18th – 20th June 2017 in Gothenburg, Sweden. This is first time that IMAPS Nordic Chapter and IEEE CPMT Nordic Chapter jointly organise this event. The event brings together both academics as well as industry leaders to discuss and debate the state-of-the-art and future trends in microelectronics components, packaging, integration and manufacturing technologies. NordPac provides a perfect opportunity to hear the latest news and developments in the field. So mark the dates in your calendar today!
Location: Läppstiftet Conference Center, Gothenburg, Sweden
With well over 300 participants and together with its bi-annual co-conference ESTC, EMPC has established itself as THE trade event in Europe for microelectronic packaging. Next year's EMPC will be held at the University of Warsaw from September 10 - 13, 2017. As organizers, the Polish IMAPS Chapter cordially invites you to join them as a visitor, exhibitor or sponsor.
Since it is the first time for the conference to be organized in an eastern part of europe, we look forward to bring together the entire microelectronics supply chain. Technical and marketing professionals should complete the variety of participants, who also move on an important platform for dialogue between industry and academia.
The 50th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2017 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5 technical tracks and an Interactive Poster Session.
10-12 Oktober, 2017
Abstract submission deadline: February 15, 2017
More information: http://www.imaps.org/imaps2017/index.htm